|
·
|
Fourth quarter net revenues up
13.6% sequentially to $2,583
million
|
|
·
|
Fourth quarter operating
income, before restructuring, returned to
profitability
|
|
·
|
Fourth quarter net operating
cash flow increased to $221 million in the
quarter*
|
Q4
2009
|
Q3
2009
|
Q4
2008
|
||||||||||
Market
Segment / Channel:
|
||||||||||||
Automotive
|
13 | % | 12 | % | 12 | % | ||||||
Computer
|
14 | % | 13 | % | 11 | % | ||||||
Consumer
|
11 | % | 11 | % | 14 | % | ||||||
Industrial & Other
|
7 | % | 7 | % | 9 | % | ||||||
Telecom
|
36 | % | 41 | % | 35 | % | ||||||
Total
OEM
|
81 | % | 84 | % | 81 | % | ||||||
Distribution
|
19 | % | 16 | % | 19 | % |
(In
Million US$ & %)
|
Q4
2009
Net
Revenues
|
Q4
2009
Operating
Income
(Loss)
|
Q3
2009
Net
Revenues
|
Q3
2009
Operating
Income
(Loss)
|
Q4
2008
Net
Revenues
|
Q4
2008
Operating
Income
(Loss)
|
||||||||||||||||||
ACCI
|
997 | 57 | 852 | (36 | ) | 899 | 18 | |||||||||||||||||
IMS
|
854 | 90 | 694 | 27 | 791 | 101 | ||||||||||||||||||
Wireless
(a)
|
712 | (48 | ) | 704 | (75 | ) | 575 | (77 | ) | |||||||||||||||
Others
(b)(c)
|
20 | (105 | ) | 25 | (112 | ) | 11 | (181 | ) | |||||||||||||||
TOTAL
|
2,583 | (6 | ) | 2,275 | (196 | ) | 2,276 | (139 | ) |
Full
Year 2009
|
Full
Year 2008
|
|||||||||||||||
Product
Segment
|
Net
Revenues
|
Operating
Income
(Loss)
|
Net
Revenues
|
Operating
Income
(Loss)
|
||||||||||||
ACCI
|
3,198 | (91 | ) | 4,129 | 136 | |||||||||||
IMS
|
2,641 | 113 | 3,329 | 482 | ||||||||||||
Wireless
|
2,585 | (356 | ) | 2,030 | (65 | ) | ||||||||||
FMG
(Flash Memories Group)
|
0 | 0 | 299 | 16 | ||||||||||||
Others
|
86 | (689 | ) | 55 | (767 | ) | ||||||||||
TOTAL
|
8,510 | (1,023 | ) | 9,842 | (198 | ) |
·
|
In
automotive electronics, ST gained a major design win from a world-leading
US car maker for a 32-bit microcontroller (MCU) based
automatic-transmission platform to be deployed across all its models. The
32-bit Power Architecture MCU implements ST’s leading-edge proprietary
embedded-Flash technology. Together with Freescale, ST also introduced a
dual-core Power Architecture MCU family designed for functional safety
applications.
|
·
|
In
the powertrain arena, ST achieved a design win for a single-chip
smart-power actuator chip, manufactured in ST’s proprietary BCD
technology, from a major tier-one OEM in Europe for deployment in Europe
and America. ST also gained important design wins from major tier-one OEMs
in Europe and Japan for smart-IGBT based Electronic Ignition Drivers,
satisfying the stringent requirements of space, cost, and enhanced
functionality and diagnostics. Market demand for ST’s world-leading
expertise in smart power technology is increasingly being driven by the
CO2
reduction plans currently being executed by car
makers.
|
·
|
In
car body applications, ST consolidated its leadership position in ‘door
zone’ applications, such as controls for windows, mirrors and side-impact
airbags, with a design win from a major OEM in Europe for the market’s
largest generic platform, including all variants from low- to high-end
solutions.
|
·
|
In
automotive infotainment, ST gained an important design win for its second
generation of highly integrated car-radio receiver ICs from a leading
car-infotainment manufacturer in Japan, with production to start in H2
2010. ST also achieved a key design win, for its leading-edge
multi-standard tuner DSP family, from a leading infotainment OEM in
Europe. Additionally, ST gained an important design win for its GPS
solutions for road-tolling equipment in Germany from a leading European
manufacturer.
|
·
|
In
home entertainment applications, ST announced its adoption of the ARM®
Cortex™-A9 MPCore™ processor, in addition to the Mali®-400 graphics
processor, for its upcoming set-top-box and digital TV System-on-Chip
(SoC) ICs. The Cortex-A9 processor will provide the scalable high
performance required to enable the high-bandwidth broadband and broadcast
content being streamed into homes, while also enabling ST to leverage its
expertise in mobile markets, in close cooperation with ST-Ericsson, to
deliver world-class power
efficiency.
|
·
|
In
set-top-box (STB) applications, ST has several projects in development
with key players, based on the STi7105 HD decoder running middleware from
NDS, allowing ST to gain an important piece of this market. ST is also
winning new designs on the STi7105, including, most recently, a key
broadcaster in France. ST also announced that its highly integrated
STi5197 cable STB decoder is now shipping in high volume to leading STB
makers in China.
|
·
|
Also
in STBs, ST’s satellite front-end STB demodulator ICs are now being used
by a leading US broadcaster in outdoor dish units, which gives it the
potential to be installed in every new subscriber’s home in the US. ST
also achieved EuroDOCSIS 2.0 certification for its production-ready
reference design for feature-rich cable STBs using the STi7141
SoC.
|
·
|
In
digital TV chips, ST launched a new generation of high-performance, full
high-definition (HD) H.264/MPEG SoCs with world-class Faroudja™ video/audio
enhancements, delivering full high-definition processing and accelerated
Internet-TV support for the next-generation of integrated broadcast and
broadband digital TVs. The
|
|
new
‘Freeman’ SoCs will enable compelling services and new business models for
premium content, and will deliver a rich and intuitive user experience.
Additionally, ST gained a design win for an advanced H.264/MPEG decoder to
increase its penetration of the emerging ISDB-T DTV market in
Latin America.
|
·
|
In
multimedia display chips, ST announced two new families of Faroudja-based
LCD controller SoCs with advanced color processing and DisplayPort and
HDMI receivers to support full-HD sources, such as Blu-ray. The
DisplayPort-based STDP8028 SoC is being designed into multi-function
monitors and public displays by leading OEMs around the world, with two
tier-one manufacturers starting mass production in the quarter. In
addition, two tier-one makers also started production with the new
STDP6000 SoC.
|
·
|
Also
in displays, ST, in collaboration with LG Display, proposed the iDP
(Internal DisplayPort) interface standard, which is designed to replace
the current LVDS (Low Voltage Differential Signaling) standard, to the
Video Electronics Standards Association (VESA) TV Panel Task Group. This
new standard is being driven by the requirements for richer graphics, 3D
video and enhanced picture
quality.
|
·
|
In
consumer audio, ST announced its next-generation STA370BWS SoundTerminal™
chip, which delivers increased performance at a highly competitive price.
The new chip employs ST’s leading-edge Full Flexible Amplifier (FFX™)
technology to deliver high-quality stereo audio at 10W and above, in
various consumer applications, including the latest ultra-thin LED-backlit
Flat TVs. ST’s SoundTerminal family is currently enjoying success with
strong demand and increased market share at leading OEMs in China, Taiwan,
Korea and Japan.
|
·
|
In
imaging, ST unveiled details of its roadmap for 5M-pixel CMOS image
sensors in the standard quarter-inch optical format commonly used in
camera-phone handsets. ST’s latest leading-edge sensors offer a choice of
features creating the richest portfolio of sensors at the 5-megapixel
resolution.
|
·
|
In
communications infrastructure applications, a device in ST’s
SPEAr™ family of customizable processors was selected and qualified
by a major telecoms company in China, making it ready for implementation
in new designs from the
manufacturer.
|
·
|
In
MEMS (Micro Electro-Mechanical Systems), ST launched several new families
of motion sensors for multiple consumer and portable applications,
including: a broad range of thirteen new single- and two-axis gyroscopes;
a high-performance single-package three-axis analog gyroscope; a
motion-sensor combo module integrating a three-axis digital accelerometer
with a two-axis analog gyroscope; and a range of three-axis accelerometers
with digital output that can detect accelerations up to 24g. ST also
introduced a high-accuracy sensor for smart applications in vehicles such
as adaptive front lights and advanced anti-theft
systems.
|
·
|
ST
continued to gain numerous design wins for motion sensors in various
applications including: two digital camera manufacturers, one in Korea and
another in Japan; an important mobile phone maker in Korea; several
netbook and laptop manufacturers for free-fall protection; and a customer
in Japan for next-generation gaming
platforms.
|
·
|
Also
in MEMS, ST expanded its portfolio with next-generation acoustic MEMS
microphones that use technology from OMRON to significantly improve sound
quality, reliability, and cost-effectiveness for existing and emerging
audio applications in mobile phones, wireless devices and games that
respond to voice inputs.
|
·
|
In
remote energy-metering applications, ST announced that it has been chosen
by Enel, Italy’s largest power company, to provide the semiconductor
components for new
|
·
|
In
analog and mixed-signal ICs, ST introduced the first single-chip audio
subsystem IC to include 3D sound enhancement for improved stereo effects
in equipment such as notebook PCs, mobile internet devices and gaming
consoles. Also in the audio field, ST gained a key design win from a
world-leading mobile phone maker for a headset audio amplifier. ST also
announced a smart-reset chip that allows mobile products experiencing
‘system freeze’ to be restarted safely without removing the battery
or pushing the recessed reset button. Additionally, ST attained a number
of design wins for temperature sensor ICs in solid-state disks drives,
e-Books and other portable
applications.
|
·
|
In
advanced analog, ST introduced a series of highly accurate LED drivers
with automatic power saving, enabling electronic signage such as road
signs, advertising, stadium displays, battery or solar-powered signs and
similar equipment to deliver better high-resolution viewing by ensuring
consistent brightness across the viewing
area.
|
·
|
In
power conversion ICs, ST gained design wins for controller and
high-voltage converter chips in LED-backlit LCD TV power supplies, most
significantly with a major TV maker in Korea. ST was also chosen to supply
power management ICs for a PC graphics-card platform and gained an
important design win for the ST1S10 DC-DC converter IC with an important
STB maker in Europe. Launched approximately two years ago, this converter
IC has met with considerable success in consumer applications with
top-tier OEMs and distributors. In addition, several designs were won for
power management ICs, on recently qualified devices, both for linear and
switching regulators, in various markets and applications including
netbooks, mobile phones, printers and
gaming.
|
·
|
And
in power transistors, ST introduced a series of IGBTs that reduce the
environmental impact of daily-use equipment such as home appliances,
industrial machines and HVAC (Heating/Ventilating/Air Conditioning)
systems. ST also gained design wins for ignition IGBTs from several car
manufacturers in India. These IGBTs are optimized for pencil coil systems
and can help cut noxious emissions and reduce fuel consumption. ST also
achieved design wins for power MOSFETs in a range of applications,
primarily in consumer and lighting applications. Also, a leading
automotive OEM in Europe selected ST’s latest STripFET™ VI DeepGATE™ power
MOSFETs for use in Antilock Braking
Systems.
|
·
|
In
application-specific discrete devices, ST gained an increasing number of
design wins in areas such as telecom networking and solar panels for its
power Schottky diodes in PowerFlat halogen-free packages, which offer a
slim 1.05mm profile and very low thermal resistance, ideal for power
conversion applications. ST introduced its first ultra-low Vf power
Schoktty diodes for the 80 PLUS power-supply market. In addition, ST
introduced a family for protection against ‘electrical over-stress’ and
‘electrical static discharge’, specified to IEC 61000-4-5, which is
applicable to most telecom and industrial
equipment.
|
·
|
In
standard microcontrollers, ST achieved an industry first for MCUs based on
ARM Cortex-M processor cores with devices featuring 90nm embedded Flash,
leveraging ST’s investment in leading-edge embedded-Flash technology for
its secure and automotive MCUs to realize performance and cost advantages
for the STM32 family.
|
·
|
In
secure MCUs, ST announced its AuKey brand-protection solution, based on
ST’s ST23 highly secure MCUs, to help brand owners authenticate their
products in various applications, including computer accessories, printer
consumables, gaming peripherals and disposable medical equipment. ST also
introduced a robust low-power processor chip dedicated to managing SIM
data for machine-to-machine (M2M) cellular communications
applications.
|
·
|
In
smart cards, ST achieved the world’s first security certification at level
EAL6+ using Common Criteria 3.1 methodology, for a secure MCU that targets
security-demanding governmental applications such as passports and
identity cards.
|
·
|
In
memory ICs, ST introduced a 2-Kbit IC enabling applications for re-usable
contactless tickets for mass transit services, increasing user convenience
and operator efficiency.
|
·
|
ST
announced its cooperation with Mayo Clinic on a novel platform for the
remote monitoring of patients with chronic cardiovascular disease. The
platform will provide a comprehensive and unobtrusive solution that
monitors person-specific data and physiological parameters and influences
lifestyle and treatment
choices.
|
·
|
LG
Electronics selected ST-Ericsson’s mobile HSPA (High Speed Packet Access)
broadband modem, M340, to power the LG GW990 mobile internet device, which
will be launched in the second half of 2010. The M340 is part of the
mobile platforms solution, together with the Intel Moorestown solution.
The M340 is a small, flexible modem solution with low-power consumption
enabling high speed internet
access.
|
·
|
Nokia
and ST-Ericsson announced a long-term partnership for technology and
solutions in the area of TD-SCDMA, a 3G mobile communications standard in
China.
The partnership will see Nokia using ST-Ericsson as a key supplier of
chipset platforms in its Symbian-based TD-SCDMA devices and solutions
portfolio.
|
·
|
ST-Ericsson,
together with Ericsson, also announced the companies successfully achieved
first mobility between LTE (Long Term Evolution) and HSPA networks, using
a multimode LTE/HSPA device powered by ST-Ericsson’s M710
platform.
|
·
|
ST-Ericsson
announced its cooperation with ARM to accelerate innovation in mobile user
experience. ST-Ericsson’s U8500 is the first smartphone platform to
integrate a Mali-400 graphics processing unit providing access to a
leading-edge environment for graphics
developers.
|
·
|
Significant changes in demand
in the key application markets and from key customers served by our
products make it extremely difficult to accurately forecast and plan our
future business activities. In particular following a period of
significant order cancellations, we recently experienced a strong
surge in customer demand, which is leading to capacity constraints in
certain applications;
|
·
|
our ability to utilize and
operate our manufacturing facilities at sufficient levels to cover fixed
operating costs in periods of reduced customer demand as well as to
ramp up production efficiently and rapidly to respond to increased
customer demand, as well as the financial impact of obsolete or excess
inventories if actual demand differs from our
expectations;
|
·
|
the impact of
intellectual-property claims by our competitors or other third parties,
and our ability to obtain required licenses on reasonable terms and
conditions;
|
·
|
our ability to successfully
integrate the acquisitions we pursue, in particular the successful
integration and operation of the ST-Ericsson joint
venture;
|
·
|
we hold significant
non-marketable equity investments in Numonyx, our joint venture in the
flash-memory market segment, and in the ST-Ericsson joint venture.
Additionally, we are a guarantor for certain Numonyx debts. Therefore,
further declines in these market segments or the inability of Numonyx and
/or ST-Ericsson to successfully compete could result in further
significant impairment charges, restructuring charges and gains/losses on
equity investments;
|
·
|
our ability to compete in our
industry since a high percentage of our costs are fixed and are incurred
in currencies other than U.S. dollars, especially in light of the
volatility in the foreign exchange markets and more particularly in the
rate of the U.S. Dollar compared to the other major currencies which we
use for our
operations;
|
·
|
our ability to execute our
restructuring initiatives in accordance with our plans if unforeseen
events require adjustments or delays in implementation or require new
plans;
|
·
|
our ability in an intensively
competitive environment to secure customer acceptance and to achieve our
pricing expectations for high-volume supplies of new products in whose
development we have been, or are currently,
investing;
|
·
|
changes in the political,
social or economic environment, including as a result of military
conflict, social unrest and/or terrorist activities, economic turmoil, as
well as natural events such as severe weather, health risks, epidemics or
earthquakes in the countries in which we, our key customers or our
suppliers, operate;
|
·
|
the outcome of ongoing
litigation as well as any new litigation to which we may become a
defendant; and
|
·
|
changes in our overall tax
position as a result of changes in tax laws or the outcome of tax audits,
and our ability to accurately estimate tax credits, benefits, deductions
and provisions and to realize deferred tax
assets.
|
Q4 2009
(US$ millions
and cents per share)
|
Gross
Profit
|
Operating
Income
(Loss)
|
Net
Earnings
(Loss)
|
Corresponding
EPS
|
||||||||||||
U.S.
GAAP
|
957 | (6 | ) | (70 | ) | (0.08 | ) | |||||||||
Impairment
& Restructuring
|
96 | 65 | ||||||||||||||
Realized
losses on financial assets
|
68 | |||||||||||||||
Estimated
Income Tax Effect
|
(27 | ) | ||||||||||||||
Non-U.S
GAAP
|
957 | 90 | 36 | 0.04 |
Q3
2009
(US$ millions
and cents per share)
|
Gross
Profit
|
Operating
Income
(Loss)
|
Net
Earnings
(Loss)
|
Corresponding
EPS
|
||||||||||||
U.S.
GAAP
|
713 | (196 | ) | (201 | ) | (0.23 | ) | |||||||||
Impairment
& Restructuring
|
53 | 45 | ||||||||||||||
Estimated
Income Tax Effect
|
3 | |||||||||||||||
Non-U.S
GAAP
|
713 | (143 | ) | (153 | ) | (0.17 | ) |
Q4 2008
(US$ millions
and cents per share)
|
Gross
Profit
|
Operating
Income
(Loss)
|
Net
Earnings
(Loss)
|
Corresponding
EPS
|
||||||||||||
U.S.
GAAP
|
822 | (139 | ) | (366 | ) | (0.42 | ) | |||||||||
NXP
Wireless Inventory Step-Up
|
31 | 31 | 31 | |||||||||||||
Impairment
& Restructuring
|
91 | 91 | ||||||||||||||
Other-Than-Temporary-Impairment
|
55 | |||||||||||||||
Numonyx
Impairment
|
180 | |||||||||||||||
Estimated
Income Tax Effect
|
(48 | ) | ||||||||||||||
Non-U.S
GAAP
|
853 | (17 | ) | (57 | ) | (0.06 | ) |
(in
US$ millions)
|
December
31, 2009
|
September
26, 2009
|
December
31, 2008
|
|||||||||
Cash
and cash equivalents, net of bank overdrafts
|
1,588 | 1,576 | 989 | |||||||||
Marketable
securities, current
|
1,032 | 955 | 651 | |||||||||
Restricted
cash
|
250 | 250 | 250 | |||||||||
Marketable
securities, non-current
|
42 | 170 | 242 | |||||||||
Total
financial resources
|
2,912 | 2,951 | 2,132 | |||||||||
Current
portion of long-term debt
|
(176 | ) | (230 | ) | (123 | ) | ||||||
Long-term
debt
|
(2,316 | ) | (2,455 | ) | (2,554 | ) | ||||||
Total
financial debt
|
(2,492 | ) | (2,685 | ) | (2,677 | ) | ||||||
Net
financial position
|
420 | 266 | (545 | ) |
Q4 2009 | Q3 2009 | Q4 2008 | ||||||||||
Net
cash from operating activities
|
449 | 225 | 390 | |||||||||
Net
cash used in investing activities
|
(207 | ) | (311 | ) | (172 | ) | ||||||
Payment
for purchases of / proceeds from sale of current and non-current
marketable securities, short-term deposits and restricted cash,
net
|
5 | 181 | (64 | ) | ||||||||
Net
operating cash flow
|
247 | 95 | 154 | |||||||||
Net
operating cash flow (ex M&A)
|
221 | 100 | 161 |
As
at
|
December
31,
|
September
26,
|
December
31,
|
|||||||||
In
million of U.S. dollars
|
2009
|
2009
|
2008
|
|||||||||
(Unaudited)
|
(Unaudited)
|
(Audited)
|
||||||||||
ASSETS
|
||||||||||||
Current
assets:
|
||||||||||||
Cash
and cash equivalents
|
1,588 | 1,576 | 1,009 | |||||||||
Marketable
securities
|
1,032 | 955 | 651 | |||||||||
Trade
accounts receivable, net
|
1,367 | 1,422 | 1,064 | |||||||||
Inventories,
net
|
1,275 | 1,299 | 1,840 | |||||||||
Deferred
tax assets
|
298 | 252 | 252 | |||||||||
Assets
held for sale
|
31 | 33 | - | |||||||||
Other
receivables and assets
|
753 | 1,054 | 685 | |||||||||
Total
current assets
|
6,344 | 6,591 | 5,501 | |||||||||
Goodwill
|
1,071 | 1,082 | 958 | |||||||||
Other
intangible assets, net
|
819 | 851 | 863 | |||||||||
Property,
plant and equipment, net
|
4,081 | 4,177 | 4,739 | |||||||||
Long-term
deferred tax assets
|
333 | 360 | 373 | |||||||||
Equity
investments
|
273 | 286 | 510 | |||||||||
Restricted
cash
|
250 | 250 | 250 | |||||||||
Non-current
marketable securities
|
42 | 170 | 242 | |||||||||
Other
investments and other non-current assets
|
442 | 435 | 477 | |||||||||
7,311 | 7,611 | 8,412 | ||||||||||
Total
assets
|
13,655 | 14,202 | 13,913 | |||||||||
LIABILITIES
AND SHAREHOLDERS' EQUITY
|
||||||||||||
Current
liabilities:
|
||||||||||||
Bank
overdrafts
|
0 | 0 | 20 | |||||||||
Current
portion of long-term debt
|
176 | 230 | 123 | |||||||||
Trade
accounts payable
|
883 | 954 | 847 | |||||||||
Other
payables and accrued liabilities
|
1,049 | 1,058 | 996 | |||||||||
Dividends
payable to shareholders
|
26 | 53 | 79 | |||||||||
Deferred
tax liabilities
|
20 | 8 | 28 | |||||||||
Accrued
income tax
|
126 | 136 | 125 | |||||||||
Total
current liabilities
|
2,280 | 2,439 | 2,218 | |||||||||
Long-term
debt
|
2,316 | 2,455 | 2,554 | |||||||||
Reserve
for pension and termination indemnities
|
317 | 340 | 332 | |||||||||
Long-term
deferred tax liabilities
|
37 | 23 | 27 | |||||||||
Other
non-current liabilities
|
342 | 375 | 350 | |||||||||
3,012 | 3,193 | 3,263 | ||||||||||
Total
liabilities
|
5,292 | 5,632 | 5,481 | |||||||||
Commitment
and contingencies
|
||||||||||||
Equity
|
||||||||||||
Parent
company shareholders' equity
|
||||||||||||
Common
stock (preferred stock: 540,000,000 shares authorized, not
issued;
|
1,156 | 1,156 | 1,156 | |||||||||
common
stock: Euro 1.04 nominal value, 1,200,000,000 shares authorized,
910,319,305 shares
|
||||||||||||
issued,
878,333,566 shares outstanding)
|
||||||||||||
Capital
surplus
|
2,481 | 2,470 | 2,324 | |||||||||
Accumulated
result
|
2,723 | 2,793 | 4,064 | |||||||||
Accumulated
other comprehensive income
|
1,164 | 1,255 | 1,094 | |||||||||
Treasury
stock
|
(377 | ) | (377 | ) | (482 | ) | ||||||
Total
parent company shareholders' equity
|
7,147 | 7,297 | 8,156 | |||||||||
Noncontrolling
interest
|
1,216 | 1,273 | 276 | |||||||||
Total
equity
|
8,363 | 8,570 | 8,432 | |||||||||
Total
liabilities and equity
|
13,655 | 14,202 | 13,913 |
STMicroelectronics
N.V.
|
||||||||||||
SELECTED
CASH FLOW DATA
|
Cash
Flow Data (in US$ millions)
|
Q4 2009 | Q3 2009 | Q4 2008 |
Net
Cash from operating activities
|
449 | 225 | 390 | |||||||||
Net
Cash used in investing activities
|
(207 | ) | (311 | ) | (172 | ) | ||||||
Net
Cash from (used in) financing activities
|
(218 | ) | (36 | ) | 2 | |||||||
Net
Cash increase (decrease)
|
12 | (109 | ) | 141 |
Selected
Cash Flow Data (in US$ millions)
|
Q4 2009 | Q3 2009 | Q4 2008 |
Depreciation
& amortization
|
355 | 342 | 357 | |||||||||
Payment
for Capital expenditures
|
(190 | ) | (98 | ) | (206 | ) | ||||||
Dividends
paid
|
(27 | ) | (26 | ) | (79 | ) | ||||||
Change
in inventory, net
|
11 | 174 | (166 | ) |
STMicroelectronics
N.V.
|
|
Consolidated
Statements of Income
|
|
(in
million of U.S. dollars, except per share data
($))
|
Three
Months Ended
|
||||||||
(Unaudited)
|
(Audited)
|
|||||||
December,
31
|
December,
31
|
|||||||
2009
|
2008
|
|||||||
Net
sales
|
2,570 | 2,264 | ||||||
Other
revenues
|
13 | 12 | ||||||
NET
REVENUES
|
2,583 | 2,276 | ||||||
Cost
of sales
|
(1,626 | ) | (1,454 | ) | ||||
GROSS
PROFIT
|
957 | 822 | ||||||
Selling,
general and administrative
|
(303 | ) | (304 | ) | ||||
Research
and development
|
(603 | ) | (572 | ) | ||||
Other
income and expenses, net
|
39 | 6 | ||||||
Impairment,
restructuring charges and other related closure costs
|
(96 | ) | (91 | ) | ||||
Total
Operating Expenses
|
(963 | ) | (961 | ) | ||||
OPERATING
LOSS
|
(6 | ) | (139 | ) | ||||
Other-than-temporary
impairment charge and realized losses on financial assets
|
(68 | ) | (55 | ) | ||||
Interest
income, net
|
3 | 3 | ||||||
Loss
on equity investments
|
(13 | ) | (204 | ) | ||||
Gain
on sale of financial assets
|
- | 15 | ||||||
Gain
on convertible debt buyback
|
3 | - | ||||||
LOSS
BEFORE INCOME TAXES
AND NONCONTROLLING INTEREST |
(81 | ) | (380 | ) | ||||
Income
tax benefit (expense)
|
(48 | ) | 9 | |||||
LOSS
BEFORE NONCONTROLLING INTEREST
|
(129 | ) | (371 | ) | ||||
Net
loss attributable to noncontrolling interest
|
59 | 5 | ||||||
NET
LOSS ATTRIBUTABLE TO PARENT COMPANY
|
(70 | ) | (366 | ) | ||||
LOSS
PER SHARE (BASIC) ATTRIBUTABLE TO PARENT COMPANY
SHAREHOLDERS
|
(0.08 | ) | (0.42 | ) | ||||
LOSS
PER SHARE (DILUTED) ATTRIBUTABLE TO PARENT COMPANY
SHAREHOLDERS
|
(0.08 | ) | (0.42 | ) | ||||
NUMBER
OF WEIGHTED AVERAGE
|
||||||||
SHARES
USED IN CALCULATING
|
878.3 | 878.1 | ||||||
LOSS
PER SHARE
|
STMicroelectronics
N.V.
|
||||
Consolidated
Statements of Income
|
||||
(in
million of U.S. dollars, except per share data ($))
|
Twelve
Months Ended
|
||||||||
(Unaudited)
|
(Audited)
|
|||||||
December,
31
|
December,
31
|
|||||||
2009
|
2008
|
|||||||
Net
sales
|
8,465 | 9,792 | ||||||
Other
revenues
|
45 | 50 | ||||||
NET
REVENUES
|
8,510 | 9,842 | ||||||
Cost
of sales
|
(5,884 | ) | (6,282 | ) | ||||
GROSS
PROFIT
|
2,626 | 3,560 | ||||||
Selling,
general and administrative
|
(1,159 | ) | (1,187 | ) | ||||
Research
and development
|
(2,365 | ) | (2,152 | ) | ||||
Other
income and expenses, net
|
166 | 62 | ||||||
Impairment,
restructuring charges and other related closure costs
|
(291 | ) | (481 | ) | ||||
Total
Operating Expenses
|
(3,649 | ) | (3,758 | ) | ||||
OPERATING
LOSS
|
(1,023 | ) | (198 | ) | ||||
Other-than-temporary
impairment charge and realized losses on financial assets
|
(140 | ) | (138 | ) | ||||
Interest
income, net
|
9 | 51 | ||||||
Loss
on equity investments
|
(337 | ) | (553 | ) | ||||
Gain
(loss) on sale of financial assets
|
(8 | ) | 15 | |||||
Gain
on conv. debt buyback
|
3 | - | ||||||
LOSS
BEFORE INCOME TAXES
|
(1,496 | ) | (823 | ) | ||||
AND
NONCONTROLLING INTEREST
|
||||||||
Income
tax benefit
|
95 | 43 | ||||||
LOSS
BEFORE NONCONTROLLING INTEREST
|
(1,401 | ) | (780 | ) | ||||
Net
loss (income) attributable to noncontrolling interest
|
270 | (6 | ) | |||||
NET
LOSS ATTRIBUTABLE TO PARENT COMPANY
|
(1,131 | ) | (786 | ) | ||||
LOSS
PER SHARE (BASIC) ATTRIBUTABLE TO PARENT COMPANY
SHAREHOLDERS
|
(1.29 | ) | (0.88 | ) | ||||
LOSS
PER SHARE (DILUTED) ATTRIBUTABLE TO PARENT COMPANY
SHAREHOLDERS
|
(1.29 | ) | (0.88 | ) | ||||
NUMBER
OF WEIGHTED AVERAGE
|
||||||||
SHARES
USED IN CALCULATING
|
876.9 | 892.0 | ||||||
LOSS
PER SHARE
|
STMicroelectronics
N.V.
|
||||
Date:
January
27, 2010
|
By:
|
/s/ Carlo Ferro | ||
Name: | Carlo Ferro | |||
Title: |
Executive
Vice President and
Chief
Financial Officer
|
|||